Enterprise Introduction

Bomin Electronics

Bomin Electronics was founded in 1994, stock code 603936, focusing on high-end PCB production and carry out one-stop service around "PCB + components + solutions". We have three major production bases in Shenzhen, Meizhou, and Jiangsu. The project under construction, "Bomin electronics new generation electronic information industry investment and expansion project", will create an intelligent factory focusing on high-end HDI boards, high multilayer boards, package substrate and other products.

Featured products mainly include HDI (high density interconnect) boards, high multilayer boards, microwave high-frequency boards, heavy copper boards, metal base/core boards, flexible boards, rigid-flex boards, ceramic substrate and passive device etc.. The products are widely used in high-technology fields including communication apparatus, medical devices, detection system, aerospace, household electronic products and new energy etc..

Bomin Electronics Co., Ltd.

  Bomin Electronics Co., Ltd.(former name Meizhou Bomin Electronics Co., Ltd.)was established in 2005, and it was publicly listed at Shanghai Stock Exchange with stock code 603936.

  Located at Dongsheng Industrial Park, Economic Development Experimental Zone,  Meizhou city. It covers an area of almost 80-mu, has more than 2, 500 employees; It has double-side factory, multi-layer factory, nomal & high-end HDI factory, and FPC factory and a supporting SMT production line. Thus, it is one of high-end PCB manufacturers with largest scale and most advanced equipments in Meizhou region.

Bomin electronics new generation electronic information industry investment and expansion project

The opening ceremony of the investment and expansion project of new generation electronic information industry of Bomin Electronics was held on December 17, 2021. The expansion project is located in Dongsheng Industrial Park, Meijiang district, Meizhou City, with a total investment of 3 billion yuan, covering a total area of 188492.19㎡ with annual output of 3.6 million square meters of high-end printed circuit boards.

The project is planned to be invested in two phases. The first phase is 2 billion yuan for planning, development, new plants, dormitories, warehouses and equipment purchase. One billion yuan will be invested in the second phase to continue the investment for the old factory integration. It is estimated that the first phase of the project will be put into operation in three years, and all the project will be completed and put into operation in five years. 

The main products include high-frequency & high-speed board, HDI board, high multi-layer board, package substrate and etc., which are widely used in 5g communication, server, MiniLED, industrial control, new energy vehicles and other related fields.

This project is based on the construction of a digital intelligent factory with international competitiveness, to build a benchmarking demonstration project of industrial intelligent manufacturing with “Four Platforms & One Highland”.

Shenzhen Bomin Electronics Co., Ltd.

Established in 1994, Shenzhen Bomin Electronics Co., Ltd. is a high-tech enterprise specializing in PCB manufacturer.

Located at Unit 21&22, Longwangmiao  Industrial  Park, Fuyong  Town, Baoan  District, shenzhen  city, it  has  plant  area  of  18000㎡, which mainly produces pecial circuit boards, metal based, high-frequency boards, high multi-layer thick boards(≤6.0mm), double-sided super-long boards(≤2000mm),strong curent boards and QTA. We are committed to providing one-stop services and solutions for the design, R & D, production and electrical assembly of passive components, ceramic substrates, printed circuits and electronic assemblies. And the product quality conforms to the American IPC, MlL, UL standards, it has the world-classed PCB processing equipment.

Jiangsu Bomin Electronics Co., Ltd.

Established in 2011, Jiangsu Bomin Electronics Co., Ltd. located at Electronic Information Industrial Park, Dafeng District, Yancheng City, Jiiangsu Province, it cover area of 232 mu. The first phase project mainly produces high-end electronic compone5nts such as high-level multilayer hard board and high-level HDI board. The Phase II high-level HDI (SLP, IC substrate) project has been officially put into operation in August 2022, mainly producing HDI circuit boards, FPC board, R-FPC board, integrated circuit carriers, substrate-like PCB, and substrates, focusing on 5g new market, big data, artificial intelligence, industrial Internet and other fields.

The company introduces leading industrial equipment, such as advanced pressing machine, vacuum etching line from German, fully-automated LDI exposure machine(100%LDI) from Israeli,fully-automatic optical line inspection equipment. six-spindle head NC drilling machine and routing machine and fully-automated vertical continuous electroplating via-filling line from Taiwanese etc, as well as adopts precise layer-to-layer alignment control technologies and test process so as to ensure the product quality.

The company also plans to build national-classed circuit board laboratory, as well as to introduce 3D laser system, blind-via detecting AOl automatic optical inspection Instruments, to adopt a large number of robotics, process-to-process connecting automation; and devotes to establishing efficient automation so as to drive towards being a domestic leading high-end PCB manufacturer.

Bomin Technology (Hong Kong) Co., Ltd.

  Bomin Technology ( Hong Kong) Co., Ltd. established in Hong Kong by Bomin Electronics in Aug 2017, mainly specialize in trade operations and consultant services. The company focused on Industrial investment, trade and provide consultant service of the PCB products and the related electronic products, striving to go forward hand in hand with partners at home and abroad, the company base itself upon domestic market and grow the overseas operations at the same time, through technology innovation, the company work on improving product quality and providing the customer with satisfactory service constantly.

Shenzhen Juntian Hengxun Technology Co., Ltd.

  Juntian Hengxun, a wholly-owned subsidiary under Bomin Electronics by means of merger and acquisition in August 2018, is an integrated customization PCBA solution provider for core electronic components. It is mainly engaged in the failure analysis customized development and sales of PCBA-related core electronic components, as well as provides technical support and after-sale service in quality control, technical guidance, process management, crisis disposition and other different sectors. Since its establishment in May, 2007, Juntian Hengxun has totally served more than 200 customers in the fields of intelligent control and power supply management, and has accumulated extensive experience in the application of electronic components and successful cases in the solution to failures. Through advanced research of new technologies, application and development of IC products as well as the introduction of overall customization plans, it provides professional service for domestic famous corporate customers.